Selective Soldering

Sistema de soldadura selectiva ultraflexible, fuera de línea, multiplataforma, de carga rápida, mesa rotativa doble para PCB

Diseñado para satisfacer las necesidades del fabricante de lotes pequeños que requiere altos niveles de flexibilidad de producción. El Jade Prodex ofrece la capacidad de cambiar regularmente las aleaciones de soldadura sin incurrir en un costoso tiempo de inactividad, mientras que el baño de soldadura se enfría y se calienta durante un proceso de cambio manual regular.

El Jade Prodex es un sistema fuera de línea, que incorpora un sistema de transporte de mesa giratoria de carga rápida, doble PCB, universalmente ajustable, para permitir la carga/descarga simultánea durante el procesamiento del producto.

Descripción
Como estándar, el Jade Prodex está configurado con nuestra disposición de baño de soldadura doble dúplex. En los accionamientos del eje Z independientes, esto logra una mayor flexibilidad de producción al permitir el uso de dos tamaños de punta de boquilla diferentes, que se pueden asignar según lo dicten los requisitos del proceso dentro de cualquier área particular en una PCB.

La serie Prodex está controlada por una PC, a través de PillarCOMM, una interfaz "Point & Click" basada en Windows® con una pantalla de imagen de PCB.

Además, nuestro paquete de programación fuera de línea PillarPAD opcional permite al operador producir programas independientemente de la máquina utilizando datos de Gerber.

Standard Features

• Integral PC and Machine Mounted TFT Monitor
• Duplex Twin Independent Z Axis Solder Pots
• Auto Motorised Wire Solder Feed & Level Detect
• Adjustable Rotary Table Twin Tooling Mechanism
• DC Servo Motor Axis Drive System
• Manual Fiducial Correction System
• Solder Wave Height Measurement System
• Pump RPM Monitoring
• Auto Nozzle Conditioning System
• Process Viewing Camera
• Multilevel Password Security System
• Inerted Nitrogen System
• Drop-Jet fluxer
• Light Stack Tower
• Six AP Style Solder Nozzle Tips
• Flux Level Sensor
• Internal Fume Extraction
• Colour Programming Camera
• PillarCOMM Windows® based ‘Point & Click’ interface
• PillarPAD Offline Programming Package
• Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
• Solder Pot Coding
• Lead-Free Capability
• Day-To-Day Service Kit

Monitoring Options

• Flux presence sensor – thermistor style
• Flux spray, flow, and spray & flow
• Pump rpm
• O2 ppm
• Nitrogen flow

System Options

• Top side instant IR pre-heat
• Bottom side slide in / out instant IR pre-heat
• Closed-loop pyrometer temperature control
• Bottom side hot Nitrogen selective pre-heat
• Automatic fiducial correction
• Ultrasonic fluxing
• Dual Drop-Jet / ultrasonic fluxing
• Laser PCB warp correction
• Micronozzle assembly
• Large solder bath for dedicated single dip applications
• Solder bath removal trolley
• Solder reel identification
• Larger PCB handling size
• Nitrogen generator

 Specifications

• Height: 1208mm / 47.5” to 2025mm / 80”- with light stack
• Width: 1250mm / 49“ to 1460mm / 57”- with rotate
• Depth: 2020mm / 79.5” 2240mm /88” with flux bottles
• Board size: 457mm x 508mm / 18”x 20”
• Edge clearance: Above/below 3mm
• Height clearance: Above/below 40mm nominal 70mm max. top side only
• Solder: Most commonly used solder types – including lead-free
• Solder pot capacity: 20kg standard – 30kg large bath
• Applicators: AP style – 2.5mm to 16mm dia.
•  Extended AP style – 2.5mm to 20mm dia.
•  Micronozzle – 1.5mm to 2.5mm
•  Jet-Tip style – 6mm to 40mm dia.
•  Jet-Wave nozzle – up to 25mm width
•  Specially dedicated nozzles available upon request
• Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no-clean flux, pressurised and inerted system, optional water-soluble system available
• X, Y & Z Axis resolution: 0.1mm
• Repeatability: +/- 0.05mm
• Nitrogen usage: Up to 40 litres gas/min per bath with standard AP solder nozzle, 5 bar pressure.
•  Refer to Pillarhouse for Nitrogen usage requirement with dedicated multi-tube nozzle assemblies.
• Nitrogen purity: 99.995% or better
• Power supplies: Three-phase + neutral + PE
• Voltage: 230 V phase to neutral / 400V phase to phase
• Frequency: 50/60Hz
• Power: Maximum 9kVA per phase machine configuration dependent
• Transport: Handload
• Tooling: Integral adjustable board guides, includes finger extensions and board clamps.
• Programming: PillarCOMM Windows® based ‘Point & Click’ interface

A versatile four station rotary bench top soldering machine, ideally suited for high or low volume production, the Quadron combines well proven pumped soldering techniques with advanced PLC-controlled movement technology.

Much of its versatility is owed to the specially designed programming system which allows the user access to all fluxing and soldering parameters at any time. In addition, rapid product changeover is achieved quickly and easily through simple tooling design and program identification.

The machine is at home processing both coils/sub-assemblies/transformers or small PCBs, in either small or large batches. Cycle times as low as 5 seconds can be achieved.

Description 

Fluxing System 

The flux is applied to the terminals via a crucible or sprung test probes, which is lifted from the bath to the component, this provides high quality and consistent repeatability. Flux application is of paramount importance, this is where the Quadron has an advantage, as it can control the application and avoid bobbin contamination by applying flux accurately. Excess flux and insulation residue is kept to a minimum by careful control of the dip height and immersion time, this being achieved through stepper drive motors. The Quadron can be supplied with either a fixed flux bath or self-contained recycling flux tank which helps reduce the evaporation of the flux thinners.

Soldering 

The Quadron uses a well proven solder pump system and incorporates a solder nozzle which can be of various designs to suit the product. Dross is removed from the nozzle prior to the next soldering operation by increasing the pump speed and bursting solder from the nozzle, this occurs during the index operation and does not impede the overall cycle time. The component is dipped in the solder by means of the precision stepper driven tooling slide, which provides precise, accurate and repeatable results. Also, for the optimum soldered joint, Pillarhouse is able to provide a Nitrogen shroud which makes the soldering operation totally inert and helps prevent bridging, reduces dross, and provides an improved quality. One major advantage the Quadron has is the ability to tilt a component out of the solder, this facility will help to prevent solder bridging of fine pitched connectors and the like.

Programming 

The Quadron can be quickly and easily programmed to solder a wide range of different products, e.g., coils, transformers, wire terminations and small PCB’s. The fluxing and soldering parameters are entered via a 7″ LCD display and a keyboard, to give full control of: solder bath temperature, flux, and solder dip heights (increments of 0.1mm), and flux and solder immersion time (to within 0.1 of a second). Additional operations can also be controlled, e.g., component test facility, component unload and adjustment of the cycle time etc. A 7-day wake-up timer is included as standard equipment which enables the machine to be automatically powered-on and bought up to temperature prior to the start of a working shift.

System Options 

Turnover 

The optional turnover facility enables components with terminals on numerous sides to be handled on the same tooling, with fluxing and soldering performed at the same time without the need for the component to be re-loaded. Also, if a component has different soldering requirements on each side, the Quadron will identify different programming parameters for each.

Automatic Test/Unload 

An interface is provided, as standard, to allow the integration of continuity testers and/or unload facilities, offering components the ability to be tested for electrical continuity or resistance prior to the component being automatically or manually ejected as a pass or fail.

Solder Top-up 

This optional solder top-up ensures the solder level in the bath is kept constant; the level is automatically continually monitored using a temperature differential system which instructs the system to automatically top-up the solder. The wire feeder uses a reel of 3mm diameter solder which is mounted on the rear of the machine; the solder is fed into the bath pneumatically.

Specifications 

• Height: 1484mm / 58”
• Width: 630mm / 25”
• Depth: 764mm / 30”
• Solder: All commonly used solder types – including lead-free
• Applicators: Special dedicated nozzles
• Air supply pressure: 5 bar / 72 psi
• Nitrogen supply pressure: 5 bar / 72 psi
• Nitrogen purity: 99.995% or better
• Power supplies: Single phase + PE
• Voltage: 208V – 250V
• Frequency: 50/60Hz

The PillarGEN Nitrogen generation system has been specifically designed to meet the Nitrogen supply requirements of the current range of Pillarhouse selective soldering systems.
The latest Nitrogen generation design technology combines compact size with ultra-quiet operation.

The PillarGEN 30 is specifically designed to integrate with the Pillarhouse Pilot bench top soldering system.

The PillarGEN 40 and 80 systems offer a fully integrated communication protocol to allow the monitoring and displaying of the unit’s status on the selective soldering machine. These values include oxygen concentration, flow rates and pressure – incoming air/outgoing Nitrogen.

Specifications 

PillarGEN-30 

• Height: 835mm / 33”
• Width: 915mm / 36“
• Depth: 700mm / 28”
• Air requirement: 400 litres/min., 8-10 bar / 116-145 psi, 12mm input supply
• Power supplies: Single phase + PE
• Voltage: 100V – 240V
• Output: 30 litres Nitrogen/min. @ 100 ppm average 99.990%
• Operating noise level: 70 dB or less

PillarGEN-40 

• Height: 1155mm / 46”
• Width: 968mm / 38“
• Depth: 700mm / 28”
• Air requirement: 500 litres/min., 8-10 bar / 116-145 psi, 12mm input supply
• Power supplies: Single phase + PE
• Voltage: 100V – 240V
• Output: 40 litres Nitrogen/min. @ 50 ppm average 99.995%
• Operating noise level: 70 dB or less

PillarGEN-80 

• Height: 1155mm / 46”
• Width: 1020mm / 40“
• Depth: 970mm / 38”
• Air requirement: 1000 litres/min., 8-10 bar / 116-145 psi, 12mm input supply
• Power supplies: Single phase + PE
• Voltage: 100V – 240V
• Output: 80 litres Nitrogen/min. @ 50 ppm average 99.995%
• Operating noise level: 70 dB or less

This compact modular in-line system utilises the same design concept as the new generation Synchrodex soldering cell and offers the user significantly reduced process time when compared to using a single soldering unit with on-board fluxing and pre-heat functions. It also provides a reduced footprint and cost savings over the conventional three module, fluxing, pre-heat, and selective soldering work cell.

The fluxer/pre-heat combo operates in tandem with the selective soldering unit and can be configured with either Drop-Jet or ultrasonic flux heads and both top and bottom side IR pre-heat functions. Twin pitch flux heads are available for further cycle time reductions.

The machine utilises an XY positioning system to position the flux head as required. A Drop-Jet flux head is supplied as standard with an ultrasonic head being ordered as an alternative or in addition to the standard head. Both systems provide precise control of the flux being deposited on the board.

Programming and control of the machine is via a PC using the Windows® based PillarCOMMX software. Programs and machine configuration are protected by a customer selectable, multilevel password security system.

The machine is freely programmable to cater to different board layouts. Each flux joint is separately programmable to its own set of required parameters. The programming system employs a component data library enabling quantities of similar joints to use the same fluxing data outline. Visually assisted self-teach alignment allows for fast and accurate board programming.

Standard Features 

• In-line motor driven auto width adjust – through feed synchronous movement conveyor
• Conveyor side clamping
• Integral PC and machine mounted TFT monitor
• Titanium Drop-jet fluxer
• Internal fume extraction
• Colour programming camera
• PillarCOMMX Windows® based ‘Point & Click’ interface
• Light stack
• Flux level sensor
• Multiple level password protection
• SMEMA compatible
• Multiple level password protection
• Day-to-day service kit

 Monitoring Options 

• Flux presence sensor – thermistor style
• Flux spray and/or flow

 System Options 

• Ultrasonic fluxing
• Dual drop-jet / ultrasonic fluxing
• Top side instant IR pre-heat
• Closed-loop pyrometer temperature control
• Encoders on X, Y and Z axis

 Specifications 

• Height: 1615mm / 63” – excluding light stack
• Width: 813mm / 32“
• Depth: 2024mm / 80”
• Board size: Max. – 457mm x 610mm / 18”x 24”
  Min. – 102mm x 102mm / 4”x 4”
• Edge clearance: Above/below 3mm
• Height clearance: Below 40mm – above 45mm
  100mm – upon request
• Extraction: Fan: 276mm dia.
• Rating: 1000m3/hr / 589 CFM
• Flux: Low maintenance Drop-Jet system. Low solids, no clean flux, pressurised and inerted system, optional water-soluble system available.
• Flux tank capacity: 1 litre
• Fluxer speed: 50 dots/second
• Deposition size: 4.0-6.0mm / 0.16-0.24”
• X, Y & Z axis resolution: 0.15mm
• Repeatability: +/- 0.05mm.
• Nitrogen supply pressure: 5 bar / 72 psi
• Nitrogen usage: 10-30 litres/min.
• Air Supply Pressure: 5 bar / 72 psi
• Air Usage: 10 litres/min. / 0.35CFM
• Power Supplies: 1 phase + PE.
• Voltage: 230V
• Frequency: 50/60 Hz.
• Power: 13kVA max. – machine configuration dependent
• Transport: Conveyor
• Programming: PillarCOMMX Windows® based ‘Point & Click’ interface

Designed as a modular system, the Synchrodex range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high-speed throughput when multiple modules are placed together.

Supplied as standard with our patented design Drop-Jet fluxer, this system offers accurate, controlled flux deposition either prior to or during the optional top side pre-heat function. Pre-heat can be controlled via an optional top side closed-loop pyrometer system for optimum temperature profile regulation.

Our low maintenance solder bath and pump mechanism moves in three axes. Solder is applied using our proven technology - single point AP nozzle design - incorporating patented spiral solder return to bath technology, offering increased wave stability with reduced potential for solder balls.

The system can also accommodate our latest generation micronozzle, together with Jet-Wave, Wide-Wave and dedicated multi-tube single dip solder technology.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere for the soldering process and assists in the prevention of oxidation. This process provides a local pre-heat to the joint, thus reducing thermal shock to localised components.

The Synchrodex is controlled by a PC, through PillarCOMMX, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

• In-line motor driven auto width adjust through feed synchronous movement conveyor
• Conveyor side clamping
• Integral PC and machine mounted TFT monitor
• Auto solder wire feed & level detect
• Heated inerted Nitrogen system
• Drop-Jet fluxer
• Set of AP solder nozzle tips
• Internal fume extraction
• Solder wave height measurement and correction
• Colour programming camera
• Light stack tower
• Windows® based PillarCOMMX ‘Point & Click’ interface
• Auto-nozzle conditioning system
• Thermal nozzle calibration system using integrated setting camera
• Windows® based PillarCOMMX ‘Point & Click’ interface
• PillarPAD offline programming system
• Auto fiducial recognition and correction system
• Flux level sensor
• Multiple level password protection
• SMEMA compatible
• Process viewing camera with record feature
• Lead-free capability
• Day-to-day service kit

 Monitoring Options

• Flux presence sensor – thermistor style
• Flux spray, flow, and spray & flow
• Pump RPM
• O2 ppm
• Nitrogen flow

 System Options

• Ultrasonic fluxing
• Dual Drop-Jet / ultrasonic fluxing
• Top side instant IR pre-heat
• Closed-loop pyrometer temperature control
• Bottom-side hot Nitrogen selective pre-heat
• Laser PCB warp correction
• Solder reel identification
• Solder bath coding – identifies correct bath for program
• Encoders on X, Y and Z axis
• Nitrogen generator

 Specifications

• Height: 1615mm / 63” – excluding light stack
• Width: 813mm / 32“
• Depth: 2024mm / 80”
• Board size: Max. – 457mm x 610mm / 18”x 24”
  Min. – 102mm x 102mm / 4”x 4”
• Edge clearance: Above/below 3mm
• Height clearance: Below 40mm – above 45mm
  100mm – upon request
• Extraction: Fan: 276mm dia.
• Rating: 1000m3/hr / 589 CFM
• Solder: Most commonly used solder types – including lead-free
• Solder pot capacity: 15kg standard – 25kg large bath
• Applicators: AP style – 2.5 – 16mm dia.
  Extended and Jet-Tip nozzles – up to 25mm dia.
  Jet-Wave nozzles – up to 25mm width
  150mm Wave nozzle
• Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
• Flux tank capacity: 1 litre
• Fluxer speed: 50 dots/second
• Deposition size: 4.0-6.0mm / 0.16-0.24”
• X, Y & Z axis resolution: 0.15mm
• Repeatability: +/- 0.05mm
• Nitrogen supply pressure: 5 bar / 72 psi
• Nitrogen usage: 30-100 litres/min. – solder nozzle configuration dependent
• Nitrogen purity: 99.995% or better
• Air supply pressure: 5 bar / 72 psi
• Air usage: 10 litres/min. / 0.35 CFM
• Power Supplies: Single phase + PE
• Voltage: 230V
• Frequency: 50/60Hz
• Power: 10.5kVA max. – machine configuration dependent
• Transport: Conveyor
• Programming: PillarCOMMX Windows® based ‘Point & Click’ interface