Selective Soldering

Orissa Synchrodex Pro

Enhanced, flexible, in-line, modular selective soldering system

Designed as a modular system, the Synchrodex Pro range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high-speed throughput when multiple modules are placed together.

Description

Our Synchrodex Pro is a modular system with a range of in-line equipment offering the ultimate in flexibility, with the ability to upgrade to high-speed throughput when multiple modules are placed together.

The standard Synchrodex Pro solder module is supplied with an on-board Drop-Jet flux head and offers optional top side and bottom side slide in/out infra-red pre-heat linked to closed-loop pyrometer control. Pillarhouse can also configure any of our frame sizes to operate as dedicated fluxing and/or I.R./convection heating modules, which, when placed in-line with solder module(s), will significantly increase production throughput.

Our 1600mm solder module offers the ability to process PCBs using either a single or dual-bath operating format. Single bath operation allows for an alternate nozzle process on a single 610mm x 610mm PCB. Dual-bath operation allows for a dual-board, simultaneous, independent nozzle process for increased soldering flexibility on 420mm x 610mm PCBs. Pillarhouse’s uniquely flexible approach is facilitated via a software controlled, mechanical three pin stop arrangement on the conveyor section allowing for either single or dual PCB management.

Our largest PCB handling capability of 1143mm x 610mm can be achieved when using the XL frame size.

The Synchrodex Pro can be configured with any of the currently available Pillarhouse solder technologies, including single point AP-1, patented 1.5mm micronozzle, Jet-Wave and custom multi-dip. Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

The Synchrodex Pro is controlled by a PC through our next generation PillarCOMM.NET, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, PillarCOMM.NET has an offline package that allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

In-Line Disk Drive Auto Width Adjust Throughfeed Synchronous
Movement Conveyor
Conveyor Side Clamping
Integral PC and Machine Mounted TFT Monitor
Auto Motorised Solder Wire Feed & Level Detect
Drop-Jet fluxer
Heated Inerted Nitrogen System
Internal Fume Extraction
Colour Programming Camera
610mm x 610mm (24" x 24") Board Handling Size in a 1060mm Frame
PillarCOMM.NET Windows® based Software
Offline Programming Software
Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
Solder Pot Coding
Auto Fiducial Recognition & Correction System
Solder Wave Height Measurement
Mechanical Impellor Style Pump Assembly
Pump RPM Monitoring
Nitrogen Analyser
Auto Nozzle Conditioning System
Process Viewing Camera
Multilevel Password Security System
Light Stack Tower
Flux Level Sensor
Lead-Free Capability
Set of Standard AP Style Solder Nozzle Tips - 2.5, 3, 3.5, 4, 5, 6, 8, 10, 12mm
Accessory Kit

Monitoring Options

Flux flow monitoring
Nitrogen purity monitoring
Nitrogen mass flow meter
Nozzle nitrogen purity monitoring

System Options

High-definition process viewing camera
Top side IR pre-heat, with closed-loop control
Motorised underside IR pre-heat, at all cell positions
Ultrasonic fluxing
Additional dual Drop-Jet / Ultrasonic fluxing
Laser-based PCB warp correction
1.5, 2, 2.5mm micronozzle(s)
Solder reel identification
Nitrogen generator

Specifications

Height: 1391mm / 55” – excluding light stack and monitor
Width: 1060mm / 42” or 1600mm / 63” (depending on frame size)
Depth: 2250mm / 88”
Board size: Min. – 102mm x 102mm / 4”x 4” Max. (standard variants) – 420mm x 610mm / 16.5” x 24” and 610mm x 610mm / 24” x 24” (optional sizes) – 1143mm x 610mm / 45” x 24”
Edge clearance: Above/below 3mm
Height clearance: Above 45mm / below 40mm nominal
Extraction: Fan: 236mm dia.
Rating: 940m³/hr/553CFM
Solder: Most commonly used solder types - includes lead-free
Solder pot capacity: 11kg/24lb (standard) - 20kg/44lb (large)
Nozzles/Applicators: Micronozzle - 1.5mm to 2.5mm AP style - 2.5mm to 16mm dia. Extended AP style - 2.5mm to 16mm dia. Jet-Tip style - 6mm to 25mm dia. Jet-Wave nozzle - up to 40mm width 75mm and 150mm Wave nozzle Special dedicated nozzles available upon request
Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional ultrasonic system available
X, Y & Z axes resolution: 0.15mm
Repeatability: +/- 0.05mm
Nitrogen supply pressure: 5 bar/72 psi
Nitrogen usage: 30-100 litres/min./1.06-3.53 CFM- solder nozzle configuration dependent
Nitrogen purity: 99.995% or better
Air supply pressure: 5 bar/72 psi
Air usage: 10 litres/min./0.35 CFM
Power supplies: Three-phase + neutral + PE
Voltage: 230 V phase to neutral/400V phase to phase
Frequency: 50/60Hz
Power: Machine configuration dependent
Transport: Conveyor (IPC-SMEMA-9851 compliant)
Programming: PillarCOMM.NET software - Windows® based ‘Point & Click’ interface

Orissa Fusion

High-speed, in-line, multi-platform selective soldering system Incorporating high-speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.

Description

The Orissa Fusion is available in two frame sizes:

Fusion Compact

The three-station cell Fusion 3 Compact – fluxer, pre-heat, solder - can be configured to handle PCBs up to 381mm x 430mm, with a larger PCB handling size available upon request. For increased soldering capability, this same unit can be configured as fluxer/pre-heat and two solder modules.

Fusion Standard

The standard four-station cell Fusion 4 – fluxer, pre-heat, solder, solder - can be configured to handle PCBs up to 381mm x 430mm, with a larger PCB handling size available upon request. For high-speed applications, this same unit can be configured as fluxer/pre-heat and up to three solder modules with as many as five heater options.

Each solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave, and single point AP down to the patented 1.5mm micronozzle.

Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

Configurations

Fusion Compact

Fusion 3 Compact – with independent Drop-Jet jet fluxer, top & bottom IR pre-heat and single solder module (includes top side IR pre-heat above solder module)
Fusion 3 Compact – with independent Drop-Jet fluxer and twin single solder modules (includes top side IR pre-heat above both solder modules)

Fusion Standard

Fusion 4 – with independent Drop-Jet fluxer, top & bottom IR pre-heat and twin solder modules (includes top side pre-heat above both solder modules)
Fusion 4 – with independent Drop-Jet fluxer and triple single solder modules (includes top side pre-heat above all three solder modules)

Standard Features

Integral PC and Machine Mounted TFT Monitor
In-line Motor Driven Auto Width Adjust Throughfeed Conveyor
Auto Motorised Wire Solder Feeder & Level Detect
DC Servo Motor Axis Drive System
Auto Fiducial Recognition & Correction System
Solder Wave Height Measurement System
Auto Nozzle Conditioning System
Process Viewing Camera
Multilevel Password Security System
Inerted Nitrogen System
Pump RPM Monitoring - enabled as standard but option to disable if preferred
Drop-Jet fluxer
Flux Level Sensor
Light Stack Tower
Six AP Solder Nozzle Tips
Internal Fume Extraction
Colour Programming Camera
Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
Solder Pot Coding
PillarCOMM.NET Windows® based ‘Point & Click’ interface
Offline programming Software
Lead-Free Compatible
Day-to-day Service Kit

Monitoring Options

Flux presence sensor – thermistor style
Flux spray, flow, and spray & flow
O2 ppm
Nitrogen flow

System Options

Ultrasonic fluxing
Dual Drop-Jet / ultrasonic fluxing
Top side instant IR pre-heat
Bottom side IR pre-heat
Closed-loop pyrometer temperature control
Large solder bath for dedicated single dip applications
Laser PCB warp correction
1.5mm micronozzle
Solder reel identification
Larger PCB handling size
Nitrogen generator
PillarCARE – our comprehensive after-sale and service programme

Specifications

Height: 1390mm / 55” to 2045mm / 80½”- with light stack
Width: 2193mm / 86½“ Compact 2930mm / 115½” Standard
Depth: 1520mm / 60” 1740mmm / 68½” with flux bottles
Board size: 381mm x 430mm / 15”x 17” – larger size available upon request
Edge clearance: Above / below 3mm
Height clearance: Above / below 40mm nominal, 70mm max.
Solder: Most commonly used solder types – including lead-free
Solder pot capacity: 6-7kg standard – 30kg large bath
Applicators: AP style – 2.5 – 16mm dia.
Extended and Jet-Tip nozzles – up to 25mm dia.
Jet-Wave nozzles – up to 25mm width
Special dedicated nozzles available upon request
Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
X, Y & Z Axis resolution: 0.15mm
Repeatability: +/- 0.05mm
Nitrogen usage: 40 litres gas/min per bath using single bath with standard AP solder nozzle, 5 bar / 72 psi pressure.
Nitrogen purity: 99.995% or better
Air supply pressure: 5 bar / 72 psi
Power supplies: Three-phase + neutral + PE
Voltage: 230 V phase to neutral / 400V phase to phase
Frequency: 50/60Hz
Power: Machine configuration dependent – contact your local Pillarhouse representative
Transport: Motorised conveyor
Programming: PillarCOMM.NET Windows® based ‘Point & Click’ interface

Jade Handex

Quick load, twin PCB rotary table selective soldering system

Designed to meet the needs of lean manufacturing, the Jade Handex offers high-speed flexible throughput at minimal cost.

The Jade Handex is equipped with a revolutionary twin PCB rotary table transport system to allow simultaneous load / unload during product processing.

Description

Our new generation, patented drop-jet design fluxer offers quick and effective flushing of the pressurised flux chamber. This helps to keep maintenance levels to a minimum whilst enabling the use of higher solids content fluxes, as well as water-soluble fluxes.

As part of the entry-level philosophy for this system, a newly designed low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement, whilst not limiting access to the PCB. Solder is applied using proven technology through our AP-1 nozzle design or custom specialised nozzles, incorporating patented spiral solder return-to-bath technology, offering reduced solder balling potential.

As with more sophisticated Pillarhouse systems, the soldering process is enhanced by an inerted hot Nitrogen curtain, providing an inert atmosphere for the soldering process, assisting the prevention of oxidation. This process provides a local pre-heat to the joint, thus reducing thermal shock to localised components.

The Jade Handex is controlled by a PC, through PillarCOMMX, a Windows® based “Point & Click” interface with PCB image display.

Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

Integral PC and Machine Mounted TFT Monitor
Inerted Nitrogen System
Auto Motorised Solder Wire Feed & Level Detect
Drop-Jet fluxer
Internal Fume Extraction
Colour Programming Camera
Rotary Indexing Table with Twin Work Holding Positions
Manual Fiducial Correction System
PillarCOMMX Windows® based ‘Point & Click’ interface
Thermal Nozzle Calibration System using Integrated
Setting Camera (requires manual correction)
Flux Level Sensor
Solder Wave Height Measurement
Pump RPM Monitoring
Auto Nozzle Conditioning System
Process Viewing Camera
Multilevel Password Security System
Light Stack Tower
Lead Free Capability
9 AP Solder Nozzle Tips
Day-to-day Service Kit

Monitoring Options

Flux presence sensor – thermistor style
Flux spray monitoring
Flux flow monitoring
Flux spray & flow monitoring
O2 ppm monitoring

System Options

Ultrasonic fluxing
Dual drop-jet / ultrasonic fluxing
Top side instant IR pre-heat
Bottom side slide-in / slide-out IR pre-heat
Pyrometer closed-loop temperature control
Solder reel identification
Solder bath coding (identifies correct bath for program)
Fiducial recognition and correction system
Laser board warpage control
PillarPAD offline programming system
Encoders on X, Y and Z axis

Specifications

Height: 1627mm (64”) – (excluding light tower)
Width: 1900mm (74“)
Depth: 2508mm (99”)
Maximum Board size: 457mm x 508mm (18” x 20”)
Edge Clearance: Above / below 3mm
Height Clearance: Above 95mm / below 45mm nominal
Solder: All commonly used solder types (including Lead-Free)
Solder pot capacity: 15kg (33lb) – standard 25kg (55lb) – large bath
Applicators: AP-1 style – 2.5mm to 16mm dia.
Extended AP style – 2.5mm to 20mm dia.
Micronozzle – 1.5mm to 2.5mm
Jet-tip style – 6mm to 40mm dia.
Jet-Wave nozzle – up to 25mm width
Special dedicated nozzles available upon request
Flux: Low maintenance drop-Jet system. Low solids, no clean flux, pressurised and inerted system, optional water-soluble system available
X, Y & Z Axis Resolution: 0.15mm
Repeatability: +/- 0.05mm
Nitrogen usage: 30-100 litres/min. – solder nozzle configuration dependent
Nitrogen Purity: 99.995% or better
Power Supplies: Single phase + PE
Voltage: 230 V
Frequency: 50/60Hz
Power: 10.5kVA max. – Machine configuration dependent.
Programming: PillarCOMMX Windows® based ‘Point & Click’ interface

Jade Prodex

Ultra-flexible, offline, multi-platform, quick load twin PCB rotary table selective soldering system

Designed to meet the needs of the small-batch manufacturer who requires high levels of production flexibility. The Jade Prodex offers the ability to regularly change solder alloys without incurring expensive down time, whilst the solder bath cools down and heats up during a regular manual changeover process.

The Jade Prodex is an offline system, incorporating a quick load, twin PCB, universally adjustable, rotary table transport system to allow simultaneous load / unload during product processing.

Description
As standard, the Jade Prodex is configured with our Duplex twin solder bath arrangement. On independent Z axis drives, this achieves increased production flexibility by permitting the use of two different nozzle tip sizes, which can be allocated as process requirements dictate within any particular area on a PCB.

The Prodex series is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with a PCB image display.

Additionally, our optional PillarPAD offline programming package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

Integral PC and Machine Mounted TFT Monitor
Duplex Twin Independent Z Axis Solder Pots
Auto Motorised Wire Solder Feed & Level Detect
Adjustable Rotary Table Twin Tooling Mechanism
DC Servo Motor Axis Drive System
Manual Fiducial Correction System
Solder Wave Height Measurement System
Pump RPM Monitoring
Auto Nozzle Conditioning System
Process Viewing Camera
Multilevel Password Security System
Inerted Nitrogen System
Drop-Jet fluxer
Light Stack Tower
Six AP Style Solder Nozzle Tips
Flux Level Sensor
Internal Fume Extraction
Colour Programming Camera
PillarCOMM Windows® based ‘Point & Click’ interface
PillarPAD Offline Programming Package
Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
Solder Pot Coding
Lead-Free Capability
Day-To-Day Service Kit

Monitoring Options

Flux presence sensor – thermistor style
Flux spray, flow, and spray & flow
Pump rpm
O2 ppm
Nitrogen flow

System Options

Top side instant IR pre-heat
Bottom side slide in / out instant IR pre-heat
Closed-loop pyrometer temperature control
Bottom side hot Nitrogen selective pre-heat
Automatic fiducial correction
Ultrasonic fluxing
Dual Drop-Jet / ultrasonic fluxing
Laser PCB warp correction
Micronozzle assembly
Large solder bath for dedicated single dip applications
Solder bath removal trolley
Solder reel identification
Larger PCB handling size
Nitrogen generator

Specifications

Height: 1208mm / 47.5” to 2025mm / 80”- with light stack
Width: 1250mm / 49“ to 1460mm / 57”- with rotate
Depth: 2020mm / 79.5” 2240mm /88” with flux bottles
Board size: 457mm x 508mm / 18”x 20”
Edge clearance: Above/below 3mm
Height clearance: Above/below 40mm nominal 70mm max. top side only
Solder: Most commonly used solder types – including lead-free
Solder pot capacity: 20kg standard – 30kg large bath
Applicators: AP style – 2.5mm to 16mm dia.
Extended AP style – 2.5mm to 20mm dia.
Micronozzle – 1.5mm to 2.5mm
Jet-Tip style – 6mm to 40mm dia.
Jet-Wave nozzle – up to 25mm width
Specially dedicated nozzles available upon request
Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no-clean flux, pressurised and inerted system, optional water-soluble system available
X, Y & Z Axis resolution: 0.1mm
Repeatability: +/- 0.05mm
Nitrogen usage: Up to 40 litres gas/min per bath with standard AP solder nozzle, 5 bar pressure.
Refer to Pillarhouse for Nitrogen usage requirement with dedicated multi-tube nozzle assemblies.
Nitrogen purity: 99.995% or better
Power supplies: Three-phase + neutral + PE
Voltage: 230 V phase to neutral / 400V phase to phase
Frequency: 50/60Hz
Power: Maximum 9kVA per phase machine configuration dependent
Transport: Handload
Tooling: Integral adjustable board guides, includes finger extensions and board clamps.
Programming: PillarCOMM Windows® based ‘Point & Click’ interface

Jade Pro

Ultra-flexible, offline, multi-platform selective soldering system

Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Pro offers the ability to regularly change solder alloys without incurring expensive down time, whilst the solder bath cools down and heats up during a regular manual changeover process.

Description

The Jade Pro is a handload system, incorporating a universally adjustable tooling carrier capable of accommodating PCBs or pallets up to 457x508mm.

As standard, the Jade Pro is configured with our Duplex twin solder bath arrangement. This twin independent Z axis solder bath arrangement offers increased production flexibility by permitting use of two different nozzle tip sizes within any single process programme, which can be allocated as process requirements dictate within any particular area on a PCB. Alternatively, different solder alloys can be utilised within this single machine setup.

The Jade Pro series is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with a PCB image display.

Additionally, our PillarPAD offline programming package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

Integral PC and Machine Mounted TFT Monitor
Duplex Twin Independent Z Axis Solder Pots
Auto Solder Top-Up (Wire Feed) & Solder Level Detect
DC Servo Drives
Manual Fiducial Correction System
Solder Wave Height Measurement & Correction
Pump RPM Monitoring
Auto Nozzle Conditioning System
Process Viewing Camera(s)
Multilevel Password Security System
Inerted Nitrogen System
Drop-Jet fluxer
Flux Level Sensor
Light Stack Tower
Six AP Style Solder Nozzle Tips
Internal Fume Extraction
Colour Programming Camera
Universally Adjustable Tooling Carrier
PillarCOMM Windows® based ‘Point & Click’ interface
PillarPAD Offline Programming Package
Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
Solder Pot Coding
Lead-Free Capability
Day-To-Day Service Kit
Initial Solder Fill (63:37 only)

Monitoring Options

Flux presence sensor – thermistor style
Flux spray, flow, and spray & flow
Pump rpm
O2 ppm
Nitrogen flow

System Options

Top side instant IR pre-heat
Bottom-side slide in / out instant IR pre-heat
Closed-loop pyrometer temperature control
Bottom side hot Nitrogen selective pre-heat
Automatic fiducial correction
Ultrasonic fluxing
Dual Drop-Jet / ultrasonic fluxing
Laser PCB warp correction
Micronozzle assembly
Large solder bath for dedicated single dip applications
Solder bath removal trolley
Solder reel identification
Larger PCB handling size

Specifications

Height: 1230mm / 48” to 2025mm / 80″- with light stack
Width: 1250mm / 49“ to 1700mm / 67”- with side auto changer
Depth: 1495mm / 59”1720mm / 68” with flux bottles
Board size: 457mm x 508mm / 18”x 20”
Edge clearance: Above / below 3mm
Height clearance: Above / below 40mm nominal 90mm max. top side only
Solder: Most commonly used solder types – including lead-free
Solder pot capacity: 20kg standard – 30kg large bath
Applicators: AP style – 2.5mm to 16mm dia.
Extended AP style – 2.5mm to 20mm dia.
Micronozzle – 1.5mm to 2.5mm
Jet-Tip style – 6mm to 40mm dia.
Jet-Wave style – up to 25mm width
Specially dedicated nozzles available upon request
Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no-clean flux, pressurised and inerted system, optional water-soluble system available
X, Y & Z Axis resolution: 0.1mm
Repeatability: +/- 0.05mm
Nitrogen usage: Up to 40 litres gas/min per bath with standard AP solder nozzle, 5 bar pressure.
Refer to Pillarhouse for Nitrogen usage requirement with dedicated multi-tube nozzle assemblies.
Nitrogen purity: 99.995% or better
Air supply pressure: 5 bar / 72 psi
Power supplies: Three-phase + neutral + PE
Voltage: 230V phase to neutral / 400V phase to phase
Frequency: 50/60Hz
Power: Maximum 9kVA per phase machine configuration dependent
Transport: Handload
Tooling: Integral adjustable board guides, includes finger extensions and board clamps.
Programming: PillarCOMM Windows® based ‘Point & Click’ interface